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  • PCB BGA Application

Clean Box Oven

Application

Batch baking for black oxide, lamination, hole plugging, solder resist, marking, inspection process.

Features

  • Quick temperature rising.
  • Air convention enhanced, damper adjustable.
  • Double over temperature protection.
  • Trolley type, N2 Purge type, steam type available.
  • Assembly and cleaning in clean room for clean oven.

Model and Basic
Specification

Model Inner (WxDxH) cm Outer (WxDxH) cm Power Temp Remark
GO-1 45*40*40 81*65*106 3KVA 200°C  
GO-2 60*50*60 96*75*130 4KVA 200°C  
GO-3 60*50*90 96*75*160 5KVA 200°C  
GO-4 80*60*100 128*85*170 7KVA 200°C  
GO-4 80*60*100 128*85*170 7KVA 200°C  
GO-5 100*60*100 161*85*178 9KVA 200°C  
GO-6 120*60*100 181*85*178 19KVA 200°C  
GO-7A 135*85*128 190*110*210 25KVA 200°C  
GO-8A 135*105*128 190*130*235 25KVA 200°C  
GO-8D 188(each 84)*71*150 277*96*229 27KVA 200°C 2 independent temp control
GO-8V 84*70*150 144*95*229 13KVA 200°C  
GO-8W 188*70*150 249*95*229 25KVA 200°C  
GO-9 180*100*140 211*125*225 24KVA 200°C  
GO-10 180*140*140 211*165*225 28KVA 200°C  
* Other max temperature 600°C and various size ranges are available, please make enquiry.

Option items

1. TRAY

TRAY

2. TROLLEY

TROLLEY1TROLLEY2
* Other various material and usages are available, please make enquiry.

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